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ocds-b5fd17-b1e87280-efde-4f0b-b83b-fb9e322092f5Published facts
6ca65c48-42ad-444c-a3eb-477fe75ce1a4-711682STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.
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6ca65c48-42ad-444c-a3eb-477fe75ce1a4-711682Awards and suppliers
Buyer: UK Research & InnovationSupplier: HHV Ltd
ocds-b5fd17-b1e87280-efde-4f0b-b83b-fb9e322092f5-1End dates, recurrence wording and links are shown as they appear in public notices. They do not create a new opportunity. If no later linked record appears here, that means Bidwake did not find one in the records it has loaded; it does not prove that none exists.