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017dde3d-5c4d-4361-8987-a018a35cb58c-168753- Published tags
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ocds-b5fd17-e471c3a9-56bd-41c6-918b-405d4c68575bPublished facts
017dde3d-5c4d-4361-8987-a018a35cb58c-168753The Purchaser is inviting tenders on the terms set out in this ITT for the supply of an Automatic/Programmable Wire Bonder to be used in the Physics Department at Lancaster University. The primary objective of this bonder is to be able to deliver gold stud bumps with a pitch of 50 µm for Pixel Detector Prototyping. While we are aware that this is beyond standard specification, we would like to make sure that the machine is in principle able to aim for such a pitch that requires ~35µm diameter gold balls and can work with 12µm diameter gold wire. The secondary objective is to be able to deliver aluminium wedge-wedge wirebonds to pads with 75µm pitch or larger, usually with 25µm diameter aluminium wire
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017dde3d-5c4d-4361-8987-a018a35cb58c-168753Awards and suppliers
Buyer: Lancaster UniversitySupplier: Accelonix Limited
ocds-b5fd17-e471c3a9-56bd-41c6-918b-405d4c68575b-1End dates, recurrence wording and links are shown as they appear in public notices. They do not create a new opportunity. If no later linked record appears here, that means Bidwake did not find one in the records it has loaded; it does not prove that none exists.