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Public procurement
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ocds-h6vhtk-05f82ePublished facts
043912-2026National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.
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Tender notice observed
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083991-2025Award notice observed
Latest variant observed by Bidwake on .
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043912-2026Awards and suppliers
Buyer: University of StrathclydeSupplier: INSETO (UK) LIMITED
043912-2026-UOS-39043-2025-1End dates, recurrence wording and links are shown as they appear in public notices. They do not create a new opportunity. If no later linked record appears here, that means Bidwake did not find one in the records it has loaded; it does not prove that none exists.