Tender notice observed
Latest variant observed by Bidwake on .
Open this official Find a Tender notice
Record references
- Release reference
074374-2026- Published tags
- tender
Loading records…
Public procurement
See the published facts, notice history, awards and supplier links in one place. Open the original Find a Tender notice for the full record.
ocds-h6vhtk-06dcdbPublished facts
074374-2026Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a High Accuracy Motion Control and Imaging System.
Observed notice trail
Events follow the publisher date where one is available. “Seen by Bidwake” is the date this service first found the record.
Tender notice observed
Latest variant observed by Bidwake on .
Open this official Find a Tender notice
074374-2026Awards and suppliers
The source record does not include an award.
End dates, recurrence wording and links are shown as they appear in public notices. They do not create a new opportunity. If no later linked record appears here, that means Bidwake did not find one in the records it has loaded; it does not prove that none exists.